View 74LVC1G34GW_1202655.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

74LVC1G34
Single buffer
Rev. 02 -- 21 May 2007 Product data sheet
1. General description
The 74LVC1G34 provides a low-power, low-voltage single buffer. The input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. Schmitt trigger action at all inputs makes the circuit highly tolerant of slower input rise and fall times.
2. Features
s s s s Wide supply voltage range from 1.65 V to 5.5 V 5 V tolerant inputs for interfacing with 5 V logic High noise immunity Complies with JEDEC standard: x JESD8-7 (1.65 V to 1.95 V) x JESD8-5 (2.3 V to 2.7 V) x JESD8-B/JESD36 (2.7 V to 3.6 V). 24 mA output drive (VCC = 3.0 V) ESD protection: x HBM JESD22-A114E exceeds 2000 V x MM JESD22-A115-A exceeds 200 V CMOS low power consumption Latch-up performance exceeds 250 mA Direct interface with TTL levels Multiple package options Specified from -40 C to +85 C and -40 C to +125 C
s s
s s s s s
NXP Semiconductors
74LVC1G34
Single buffer
3. Ordering information
Table 1. Ordering information Package Temperature range Name 74LVC1G34GW 74LVC1G34GV 74LVC1G34GM 74LVC1G34GF -40 C to +125 C -40 C to +125 C -40 C to +125 C -40 C to +125 C TSSOP5 SC-74A XSON6 XSON6 Description plastic thin shrink small outline package; 5 leads; body width 1.25 mm plastic surface-mounted package; 5 leads Version SOT353-1 SOT753 Type number
plastic extremely thin small outline package; no leads; SOT886 6 terminals; body 1 x 1.45 x 0.5 mm plastic extremely thin small outline package; no leads; SOT891 6 terminals; body 1 x 1 x 0.5 mm
4. Marking
Table 2. Marking Marking code YN YN YN YN Type number 74LVC1G34GW 74LVC1G34GV 74LVC1G34GM 74LVC1G34GF
5. Functional diagram
2
A
Y
4
2
4 A Y
001aac536
001aac538
001aac537
Fig 1. Logic symbol
Fig 2. IEC logic symbol
Fig 3. Logic diagram
74LVC1G34_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 21 May 2007
2 of 15
NXP Semiconductors
74LVC1G34
Single buffer
6. Pinning information
6.1 Pinning
74LVC1G34 74LVC1G34
n.c. A 1 2 GND GND 3
001aag503
n.c. 5 VCC
1
6
VCC n.c. A
74LVC1G34
1 2 3 6 5 4 VCC n.c. Y
A
2
5
n.c.
3
4
Y
GND
4
Y
001aag504
001aag505
Transparent top view
Transparent top view
Fig 4. Pin configuration SOT353-1 and SOT753
Fig 5. Pin configuration SOT886
Fig 6. Pin configuration SOT891
6.2 Pin description
Table 3. Symbol n.c. A GND Y n.c. VCC Pin description Pin SOT353-1/SOT753 1 2 3 4 5 SOT886/SOT891 1 2 3 4 5 6 not connected data input ground (0 V) data output not connected supply voltage Description
7. Functional description
Table 4. Input A L H
[1] H = HIGH voltage level; L = LOW voltage level.
Function table[1] Output Y L H
74LVC1G34_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 21 May 2007
3 of 15
NXP Semiconductors
74LVC1G34
Single buffer
8. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK VI IOK VO IO ICC IGND Ptot Tstg
[1] [2] [3]
Parameter supply voltage input clamping current input voltage output clamping current output voltage output current supply current ground current total power dissipation storage temperature
Conditions VI < 0 V
[1]
Min -0.5 -50 -0.5 [1][2] [1][2]
Max +6.5 +6.5 50 VCC + 0.5 +6.5 50 100 250 +150
Unit V mA V mA V V mA mA mA mW C
VO > VCC or VO < 0 V Active mode Power-down mode VO = 0 V to VCC
-0.5 -0.5 -100
Tamb = -40 C to +125 C
[3]
-65
The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed. When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation. For TSSOP5 and SC-74A packages: above 87.5 C the value of Ptot derates linearly with 4.0 mW/K. For XSON6 packages: above 45 C the value of Ptot derates linearly with 2.4 mW/K.
9. Recommended operating conditions
Table 6. Symbol VCC VI VO Tamb t/V Recommended operating conditions Parameter supply voltage input voltage output voltage ambient temperature input transition rise and fall rate VCC = 1.65 V to 2.7 V VCC = 2.7 V to 5.5 V Active mode VCC = 0 V; Power-down mode Conditions Min 1.65 0 0 0 -40 Typ Max 5.5 5.5 VCC 5.5 +125 20 10 Unit V V VO VO C ns/V ns/V
74LVC1G34_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 21 May 2007
4 of 15
NXP Semiconductors
74LVC1G34
Single buffer
10. Static characteristics
Table 7. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Tamb = -40 C to +85 VIH C[1] VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VIL LOW-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VOH HIGH-level output voltage VI = VIH or VIL IO = -100 A; VCC = 1.65 V to 5.5 V IO = -4 mA; VCC = 1.65 V IO = -8 mA; VCC = 2.3 V IO = -12 mA; VCC = 2.7 V IO = -24 mA; VCC = 3.0 V IO = -32 mA; VCC = 4.5 V VOL LOW-level output voltage VI = VIH or VIL IO = 100 A; VCC = 1.65 V to 5.5 V IO = 4 mA; VCC = 1.65 V IO = 8 mA; VCC = 2.3 V IO = 12 mA; VCC = 2.7 V IO = 24 mA; VCC = 3.0 V IO = 32 mA; VCC = 4.5 V II IOFF ICC ICC CI VIH input leakage current power-off leakage current supply current additional supply current input capacitance HIGH-level input voltage VCC = 0 V to 5.5 V; VI = 5.5 V or GND VCC = 0 V; VI or VO = 5.5 V VCC = 1.65 V to 5.5 V; IO = 0 A; VI = 5.5 V or GND VCC = 2.3 V to 5.5 V; VI = VCC - 0.6 V; IO = 0 A VCC = 3.3 V; VI = GND to VCC VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V VIL LOW-level input voltage VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V to 3.6 V VCC = 4.5 V to 5.5 V
74LVC1G34_2
Conditions
Min 0.65 x VCC 1.7 2.0 0.7 x VCC VCC - 0.1 1.2 1.9 2.2 2.3 3.8 [2]
Typ 1.54 2.15 2.50 2.62 4.11 0.07 0.12 0.17 0.33 0.39 0.1 0.1 0.1 5 4 -
Max 0.35 x VCC 0.7 0.8 0.3 x VCC 0.10 0.45 0.30 0.40 0.55 0.55 5 10 10 500 0.35 x VCC 0.7 0.8 0.3 x VCC
Unit V V V V V V V V V V V V V V V V V V V V A A A A pF V V V V V V V V
5 of 15
HIGH-level input voltage
-
[2]
0.65 x VCC 1.7 2.0 0.7 x VCC -
Tamb = -40 C to +125 C
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 21 May 2007
NXP Semiconductors
74LVC1G34
Single buffer
Table 7. Static characteristics ...continued At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter VOH HIGH-level output voltage Conditions VI = VIH or VIL IO = -100 A; VCC = 1.65 V to 5.5 V IO = -4 mA; VCC = 1.65 V IO = -8 mA; VCC = 2.3 V IO = -12 mA; VCC = 2.7 V IO = -24 mA; VCC = 3.0 V IO = -32 mA; VCC = 4.5 V VOL LOW-level output voltage VI = VIH or VIL IO = 100 A; VCC = 1.65 V to 5.5 V IO = 4 mA; VCC = 1.65 V IO = 8 mA; VCC = 2.3 V IO = 12 mA; VCC = 2.7 V IO = 24 mA; VCC = 3.0 V IO = 32 mA; VCC = 4.5 V II IOFF ICC ICC input leakage current power-off leakage current supply current additional supply current VCC = 0 V to 5.5 V; VI = 5.5 V or GND VCC = 0 V; VI or VO = 5.5 V VCC = 1.65 V to 5.5 V; IO = 0 A; VI = 5.5 V or GND VCC = 2.3 V to 5.5 V; VI = VCC - 0.6 V; IO = 0 A 0.10 0.70 0.45 0.60 0.80 0.80 100 200 200 5000 V V V V V V A A A A VCC - 0.1 0.95 1.7 1.9 2.0 3.4 V V V V V V Min Typ Max Unit
[1] [2]
All typical values are measured at Tamb = 25 C. These typical values are measured at VCC = 3.3 V.
74LVC1G34_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 21 May 2007
6 of 15
NXP Semiconductors
74LVC1G34
Single buffer
11. Dynamic characteristics
Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 8. Symbol Parameter tpd Conditions
[2]
-40 C to +85 C Min Typ[1] 4.0 2.6 2.3 2.0 1.6 15 Max 8.6 4.4 4.5 4.1 3.2 -
-40 C to +125 C Min 1.0 0.5 0.5 0.5 0.5 Max 11.0 5.6 5.6 5.2 4.1 -
Unit
propagation delay A to Y; see Figure 7 VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V
1.0 0.5 0.5 0.5 0.5
[3]
ns ns ns ns ns pF
CPD
power dissipation capacitance
VI = GND to VCC; VCC = 3.3 V
-
[1] [2] [3]
Typical values are measured at Tamb = 25 C and VCC = 1.8 V, 2.5 V, 2.7 V, 3.3 V, and 5.0 V respectively. tpd is the same as tPLH and tPHL. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL x VCC2 x fo) = sum of outputs.
12. Waveforms
VI A input GND t PHL VOH Y output VOL VM
mnb153
VM
t PLH
Measurement points are given in Table 9. VOL and VOH are typical output voltage drops that occur with the output load.
Fig 7. The data input (A) to output (Y) propagation delays
74LVC1G34_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 21 May 2007
7 of 15
NXP Semiconductors
74LVC1G34
Single buffer
Table 9. VCC
Measurement points Input VM 0.5 x VCC 0.5 x VCC 1.5 V 1.5 V 0.5 x VCC Output VM 0.5 x VCC 0.5 x VCC 1.5 V 1.5 V 0.5 x VCC
Supply voltage 1.65 V to 1.95 V 2.3 V to 2.7 V 2.7 V 3.0 V to 3.6 V 4.5 V to 5.5 V
VEXT VCC PULSE GENERATOR VI DUT
RT CL RL RL
VO
mna616
Test data is given in Table 10. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times.
Fig 8. Load circuitry for switching times Table 10. VCC 1.65 V to 1.95 V 2.3 V to 2.7 V 2.7 V 3.0 V to 3.6 V 4.5 V to 5.5 V Test data Input VI VCC VCC 2.7 V 2.7 V VCC tr = t f 2.0 ns 2.0 ns 2.5 ns 2.5 ns 2.5 ns Load CL 30 pF 30 pF 50 pF 50 pF 50 pF RL 1 k 500 500 500 500 VEXT tPLH, tPHL open open open open open
Supply voltage
74LVC1G34_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 21 May 2007
8 of 15
NXP Semiconductors
74LVC1G34
Single buffer
13. Package outline
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1
D
E
A X
c y HE vMA
Z
5
4
A2 A1 (A3) A
1
e e1 bp
3
wM detail X
Lp L
0
1.5 scale
3 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.1 0 A2 1.0 0.8 A3 0.15 bp 0.30 0.15 c 0.25 0.08 D(1) 2.25 1.85 E(1) 1.35 1.15 e 0.65 e1 1.3 HE 2.25 2.0 L 0.425 Lp 0.46 0.21 v 0.3 w 0.1 y 0.1 Z(1) 0.60 0.15 7 0
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT353-1 REFERENCES IEC JEDEC MO-203 JEITA SC-88A EUROPEAN PROJECTION ISSUE DATE 00-09-01 03-02-19
Fig 9. Package outline SOT353-1 (TSSOP5)
74LVC1G34_2 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 21 May 2007
9 of 15
NXP Semiconductors
74LVC1G34
Single buffer
Plastic surface-mounted package; 5 leads
SOT753
D
B
E
A
X
y
HE
vMA
5
4
Q
A A1 c
1
2
3
detail X
Lp
e
bp
wM B
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 0.100 0.013 bp 0.40 0.25 c 0.26 0.10 D 3.1 2.7 E 1.7 1.3 e 0.95 HE 3.0 2.5 Lp 0.6 0.2 Q 0.33 0.23 v 0.2 w 0.2 y 0.1
OUTLINE VERSION SOT753
REFERENCES IEC JEDEC JEITA SC-74A
EUROPEAN PROJECTION
ISSUE DATE 02-04-16 06-03-16
Fig 10. Package outline SOT753 (SC-74A)
74LVC1G34_2 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 21 May 2007
10 of 15
NXP Semiconductors
74LVC1G34
Single buffer
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
SOT886
b 1 2 3 4x L1 L
(2)
e
6 e1
5 e1
4
6x
(2)
A
A1 D
E
terminal 1 index area 0 DIMENSIONS (mm are the original dimensions) UNIT mm A (1) max 0.5 A1 max 0.04 b 0.25 0.17 D 1.5 1.4 E 1.05 0.95 e 0.6 e1 0.5 L 0.35 0.27 L1 0.40 0.32 1 scale 2 mm
Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. OUTLINE VERSION SOT886 REFERENCES IEC JEDEC MO-252 JEITA EUROPEAN PROJECTION ISSUE DATE 04-07-15 04-07-22
Fig 11. Package outline SOT886 (XSON6)
74LVC1G34_2 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 21 May 2007
11 of 15
NXP Semiconductors
74LVC1G34
Single buffer
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm
SOT891
1
2
b 3 4x
(1)
L1 e
L
6 e1
5 e1
4
6x
(1)
A
A1 D
E
terminal 1 index area 0 1 scale DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 max 0.04 b 0.20 0.12 D 1.05 0.95 E 1.05 0.95 e 0.55 e1 0.35 L 0.35 0.27 L1 0.40 0.32 2 mm
Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION SOT891 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 05-04-06 07-05-15
Fig 12. Package outline SOT891 (XSON6)
74LVC1G34_2 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 21 May 2007
12 of 15
NXP Semiconductors
74LVC1G34
Single buffer
14. Abbreviations
Table 11. Acronym CMOS DUT ESD HBM MM TTL Abbreviations Description Complementary Metal Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic
15. Revision history
Table 12. Revision history Release date 20070521 Data sheet status Product data sheet Change notice Supersedes 74LVC1G34_1 Document ID 74LVC1G34_2 Modifications:
* * * *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Added type number 74LVC1G34GF (XSON6/SOT891 package) Section 10 "Static characteristics": Changed: Conditions for input leakage and supply current. Product data sheet -
74LVC1G34_1
20051107
74LVC1G34_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 21 May 2007
13 of 15
NXP Semiconductors
74LVC1G34
Single buffer
16. Legal information
16.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
16.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
17. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
74LVC1G34_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 21 May 2007
14 of 15
NXP Semiconductors
74LVC1G34
Single buffer
18. Contents
1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 21 May 2007 Document identifier: 74LVC1G34_2

▲Up To Search▲

Price & Availability of 74LVC1G34GW

	To Download 74LVC1G34GW Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .